Industry News

Nestle Featured at RadTech Packaging Event

Nestle headlining a special day of presentations on the fast emergence of UV and EB technologies in printing and packaging applications at RadTech 2012

Author Image

By: DAVID SAVASTANO

Editor, Ink World Magazine

Dr. Stephen P. Klump, Nestlé Quality Assurance Center, is headlining a special day of presentations on the fast emergence of UV and EB technologies in printing and packaging applications, at RadTech 2012, April 30 in Chicago, IL. At the event, Dr. Klump will address Nestlé’s Approach to Packaging Safety and Compliance: Nestlé Inks Guidance Document and the Suisse Ordinance on Inks. In addition to Dr. Klump, issues presented at the event include global and regional regulatory requirements, n...

Continue reading this story and get 24/7 access to Ink World magazine for FREE


Already a subscriber? Sign in

Keep Up With Our Content. Subscribe To Ink World magazine Newsletters